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Tue, January 13, 2009

Tekelec to Present Multiple Sessions at the International SIP 2009 Conference


Published on 2009-01-13 05:51:14, Last Modified on 2009-01-13 05:52:16 - Market Wire
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MORRISVILLE, N.C.--([ BUSINESS WIRE ])--[ Tekelec ] (NASDAQ: TKLC) experts will lead multiple presentations and discussions on the capabilities of SIP technology at the [ International SIP 2009 Conference ], taking place in Paris from January 20-23.

In addition, Tekelec's team of SIP experts has started the [ SIP Sessions blog ] to establish an open forum for operators to exchange ideas and experiences on SIP and accelerate the implementation of new IP services.

"Global partners are looking to share SIP expertise and deliver the greatest customer value from SIP deployments," said Ron de Lange, executive vice president at Tekelec, "and our team of SIP pioneers and visionaries is available to educate and enable the transition to next-generation networks."

At the International SIP 2009 Conference, Dorgham Sisalem, Ph.D., director of SIP signaling architecture with Tekelec and co-founder of iptel.org, will present "SIP Security Threats and Protection" and will moderate the panel "Achieving Large-Scale SIP Services" on January 21. In addition, Victor Pascual, system architect at Tekelec, will present "Live Streaming over P2PSIP" on January 22. Cumulatively, the sessions will offer insights on new challenges and benefits of SIP architecture.

Tekelec's SIP Sessions blog features seven industry experts whose backgrounds include the prototyping, design and standardization of SIP technology. Authors are: Dan Bantukul; Ben Campbell; Ajay Deo; Jiri Kuthan; Ravi Ravishankar; Adam Roach; and Robert Sparks. Their backgrounds include companies such as Dynamicsoft, MCI, Fraunhofer, Estacado Systems and iptel.org.

Roach and Sparks chair technical groups within the Internet Engineering Task Force (IETF), the organization that records protocol standards, best practices, and technical and engineering documents to improve the Internet. Four of Tekelec's SIP experts – Campbell, Kuthan, Pascual and Sisalem – also are IETF contributors.

For further background on SIP technology, Tekelec has made its series of four SIP tutorial [ webinars ]and its [ SIP Pocket Guide ] available online. The company has also published a series of associated [ whitepapers ] which can be downloaded at no charge: Upgrading the [ Next-generation Network ][ Part I ] | [ Part II ] | [ Part III ] | [ Part IV ].

About Tekelec

Tekelec leverages its global leadership in core multimedia session control and network intelligence to ensure scalable, secure and highly available communications. The company's leading signaling solutions enable the interworking of different network applications, technologies and protocols, providing a smooth transition to next-generation networks. Corporate headquarters are located near Research Triangle Park in Morrisville, N.C., U.S.A., with research and development facilities and sales offices throughout the world. For more information, please visit [ www.tekelec.com ] and [ blog.tekelec.com ].

FORWARD-LOOKING STATEMENTS

Certain statements made in this press release are forward looking, reflect the Company's current intent, belief or expectations and involve certain risks and uncertainties. The Company's actual future performance may differ materially from such expectations as a result of important risk factors, which include, in addition to those identified in the Company's 2007 Form 10-K, First Quarter 2008 Form 10-Q, Second Quarter 2008 Form 10-Q, Third Quarter 2008 Form 10-Q and its other filings with the Securities and Exchange Commission, the effect of the current economic crisis on overall telecommunications spending by our customers, further changes in general economic conditions and unexpected changes in economic, social, or political conditions in the countries in which we operate, the timeliness and functional competitiveness of our product releases, our ability to maintain OEM, partner, and vendor support and supply relationships, our ability to compete with other manufacturers that have lower cost bases than ours and/or are partially subsidized by foreign governments or employ other unfair trade practices, changes in the market price of the Company's common stock and reductions in telecommunications carrier capital spending. The Company undertakes no obligation to publicly update any forward-looking statements whether as a result of new information, future events or otherwise.

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