Science & Technology
Science and Technology
Science and Technology
Tue, June 2, 2009
Lattice Semiconductor Corporation: Lattice Releases Industrial Temperature-Qualified LatticeXP2 FPGA Family to Volume Productio
HILLSBORO, OR--(Marketwire - June 2, 2009) - Lattice Semiconductor (
The LatticeXP2 family has been fully qualified and characterized to meet industrial temperature requirements, and is available for the full range of devices, from the smallest LatticeXP2-5 through the largest LatticeXP2-40 (5K and 40K LUTS, respectively). Depending on the device, low cost BGA and QFP packages that meet industrial temperature requirements are also available.
"Lattice has previously offered XP2 industrial temperature-qualified devices on a limited basis only," said Satwant Singh, Director of Marketing, Non-Volatile FPGAs and Solutions. "With this announcement, Lattice offers a full slate of commercial, automotive and industrial non-volatile solutions and expands its capacity to address increasing customer demand in a number of key industrial application segments. This in turn expands the overall reach of our award-winning XP2 product line into our global markets."
About flexiFLASH Architecture
Flash memory blocks are embedded within XP2 FPGAs to store the device configuration, providing a true single chip solution. At power up or on user command, the data stored in the Flash memory is transferred into SRAM cells that control the configuration of the device. This transfer is done in a massively parallel fashion, enabling the device logic to be available in approximately 1mS, well ahead of the other devices in the system and much faster than SRAM-based FPGAs that use external boot PROMs, regardless of whether they are provisioned separately on-board or stacked in the same package. This instant-on capability is critical for many system functions such as power up sequencing, address decoding and reset logic.
About the LatticeXP2 FPGA Family
The non-volatile LatticeXP2 FPGA family is a compelling solution for designers who value single chip integration, impressive processing power in the smallest footprint, source synchronous interfaces, design security and low power consumption. The XP2's unique benefits include low cost, small form factor Chip Scale 132 BGA packaging, and increased functionality such as pre-engineered source-synchronous I/O that supports 7:1 LVDS, DDR2 and high-speed ADCs/DACs.
Unlike traditional SRAM-based FPGAs, the LatticeXP2 device does not require an external boot memory for FPGA configuration, which enables a single-chip solution with the associated benefits of reduced board area and simplified system manufacture. The absence of an external boot device also eliminates the need for an external bit-stream at boot up and the possibility of bit-stream snooping, a major security concern with SRAM FPGAs. Additional security features prohibit bit-stream readback from the SRAM and Flash sections of the devices.
The LatticeXP2 design solution offers a unique set of features with broad appeal to a variety of markets, such as video security/surveillance, LCD/display controllers, automotive systems, medical imaging and industrial control systems, where processing power must be delivered with high integration in low-cost, small footprint packaging.
About Lattice Semiconductor
Lattice is the source for innovative FPGA, PLD and Mixed Signal programmable logic solutions. For more information, visit [ www.latticesemi.com ]
Lattice Semiconductor Corporation, Lattice (& design), L (& design), LatticeXP2, flexiFLASH and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.
