Science & Technology
Mon, January 24, 2011Fri, January 21, 2011Thu, January 20, 2011Wed, January 19, 2011Tue, January 18, 2011Mon, January 17, 2011Fri, January 14, 2011Thu, January 13, 2011Wed, January 12, 2011Tue, January 11, 2011Mon, January 10, 2011Fri, January 7, 2011Thu, January 6, 2011Wed, January 5, 2011Tue, January 4, 2011Mon, January 3, 2011SEMI Recognizes Developers of Tessera Chip-Scale Packaging Technology
Published in Science and Technology on Tuesday, January 11th 2011 at 14:16 GMT by Market Wire
SAN JOSE, Calif.--([ BUSINESS WIRE ])--Tessera Technologies, Inc. (Nasdaq:TSRA) congratulates Thomas DiStefano, John W. Smith, Jr. and Michael Warner on being named the recipients of the 2010 SEMI Award for North America for their contributions to Tessera® chip-scale packaging (CSP) technology.
"Our CSP technology removes semiconductor package size limitations, transforming electronics by reducing overall product dimensions, improving performance, and enabling new levels of integration and miniaturization in portable electronics."
SEMI recognized DiStefano, Smith and Warner for their significant work to develop and commercialize Tesseraa™s BGA® technology, which has been widely adopted for high-volume memory and logic devices.
aWe are pleased that SEMI has chosen to recognize these three pioneers for their innovative contributions to the electronics industry,a said Henry R. Nothhaft, chairman and chief executive, Tessera. aOur CSP technology removes semiconductor package size limitations, transforming electronics by reducing overall product dimensions, improving performance, and enabling new levels of integration and miniaturization in portable electronics.a
Safe Harbor Statement
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the development, commercialization and adoption of Tessera chip-scale packaging technology. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to our intellectual property or intellectual property litigations, or any invalidation or limitation of our key patents; fluctuations in our operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect our ability to protect our intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt our technologies; competing technologies; the future expiration of our patents; the future expiration of our license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with our existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tesseraa™s filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2009, and its Quarterly Report on Form 10-Q for the quarter ended September 30, 2010, include more information about factors that could affect the company's financial results. Tessera assumes no obligation to update information contained in this press release. Although this release may remain available on Tessera's website or elsewhere, its continued availability does not indicate that Tessera is reaffirming or confirming any of the information contained herein.
About Tessera
Tessera Technologies, Inc. invests in, licenses and delivers innovative miniaturization technologies for next-generation electronic devices. The companya™s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology. Tesseraa™s imaging and optics solutions provide low-cost, high-quality camera functionality in electronic products and include image sensor packaging, wafer-level optics and image enhancement intellectual property. The company also offers customized micro-optic lenses, from diffractive and refractive optical elements to integrated micro-optical subassemblies. Tessera licenses its technologies, as well as delivers products based on these technologies, to promote the development of the supply chain infrastructure. The company is headquartered in San Jose, California. For information call 1.408.321.6000 or go to [ www.tessera.com ].
Tessera and the Tessera logo are trademarks or registered trademarks of Tessera Inc. or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.
