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Mattson Technology Receives Multiple Helios XP Orders From a Leading Memory Customer

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  Published in Science and Technology on Monday, July 12th 2010 at 6:10 GMT by Market Wire
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FREMONT, CA--(Marketwire - July 12, 2010) - Mattson Technology, Inc. (NASDAQ: [ MTSN ]), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that a leading semiconductor memory customer based in Asia has placed multiple orders for the Helios XP rapid thermal processing (RTP) system. The systems will be delivered to the customer by the end of the current third quarter and will be used for all critical RTP steps in the customer's memory production lines. The Company noted that its Helios XP system has been installed at the customer's research and development facility and successfully met the stringent requirements of advanced RTP for 4Xnm node and below.

Senior Vice President and General Manager of Mattson Technology's Thermal Products Group, Andreas Toennis, noted, "We are extremely pleased with the Helios XP orders from this strategic customer who partnered with us in qualifying the most advanced RTP applications for their DRAM and NAND production. They challenged us with technology solutions required to advance to the next technology node while maintaining the lowest possible cost performance, and our results met or exceeded all their expectations. This order once again demonstrates Mattson's continued strength in delivering the advanced RTP capabilities our customers require at the lowest cost-of-ownership."

Toennis continued, "The Helios XP's unique and enabling capabilities provide our customers with a significant competitive advantage. The tool has the most advanced low temperature thermal processing capability, allowing the advancement of future technology node development. Enhanced temperature and ambient controls provide exceptional within-wafer uniformity and repeatability required for 4Xnm and below technology nodes. In addition, our unique double-sided wafer heating capability with our proprietary design feature has shown device yield improvement by reducing pattern-related temperature effect. Mattson's RTP position is stronger than ever, and we look forward to continuing to advance the thermal processing solutions for the industry and serving the needs of our customers."

About Mattson Technology, Inc.
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. We are a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry, and operate in three primary product sectors: Dry Strip, Rapid Thermal Processing and Etch. Through manufacturing and design innovation, we have produced technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: (800) MATTSON/(510) 657-5900. Internet: [ www.mattson.com ].

"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995: This news release contains forward-looking statements. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially. Such risks and uncertainties include, but are not limited to: end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company's products; customer acceptance of delivered products and the Company's ability to collect amounts due upon shipment and upon acceptance; the Company's ability to timely manufacture, deliver and support ordered products; the Company's ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company's competitors; the Company's ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company's Forms 10-K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.