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Tue, February 3, 2009

Zarlink Semiconductor Inc.: Zarlink Congratulates ARRIS on Shipping over 20 Million E-MTA Cable Modems


Published on 2009-02-03 08:38:01, Last Modified on 2009-02-03 08:39:08 - Market Wire
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OTTAWA, CANADA--(Marketwire - Feb. 3, 2009) - Zarlink Semiconductor Inc. (TSX:ZL).

- Zarlink Semiconductor surpasses 50 million voice lines shipped to ARRIS

- Anticipates continuing market growth from cable network expansion and joint success with future DOCSIS® 3.0 E-MTAs

Zarlink Semiconductor Inc. (TSX:ZL) today announced that it has shipped over 50 million voice lines to ARRIS Group, Inc. (NASDAQ:ARRS). Zarlink VoiceEdgeTM products enable critical voice functionality in ARRIS Touchstone® Embedded Multimedia Terminal Adaptor (E-MTA) cable modems, providing an important performance advantage that has helped them achieve market success.

"Zarlink carrier-grade voice quality and diagnostic trouble-shooting capabilities help ARRIS maintain its technical and market leadership," said Bruce McClelland, President, ARRIS Broadband Communication Systems. "To succeed in this highly competitive marketplace requires strong vendor relationships and Zarlink has always delivered."

"This milestone of 50 million voice lines shipped into the ARRIS E-MTA cable modem is a testament to Zarlink market leadership within the voice-enabled cable market," said Kirk Mandy, President and CEO, Zarlink Semiconductor. "We congratulate ARRIS for this milestone of 20 million modems shipped. Their success is an indication of the continuing expansion of cable networks, and the increasing market opportunity for Zarlink's carrier-grade voice solutions."

Zarlink VoiceEdge products offer carrier-class performance, critical diagnostic tools and market-leading customer service to the E-MTA cable modem market. This same product quality and reputation supports other voice-enabled platforms such as DSL IADs, PON ONTs, E-MTAs, WiMax gateways, Ethernet terminal adapters and enterprise MSBG.(i)

Editor Note

(i) E-MTA: Embedded Multimedia Terminal Adaptor, DOCSIS: Data Over Cable Service Interface Specification, DSL IAD: Digital Subscriber Loop Integrated Access Device, PON, Passive Optical Network, WiMax: Worldwide Interoperability for Microwave Access, MSBG: Multi-Service Business Gateway.

About Zarlink Semiconductor

For over 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths including voice and data networks, optoelectronics and ultra low-power communications. For more information, visit [ www.zarlink.com ].

Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Regulatory Authorities, should visit the Company's web site at [ www.zarlink.com ] or contact Investor Relations.

Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: our dependence on the successful development and market introduction of new products; our ability to integrate any business, technologies, product lines or services that we have or will acquire; our dependence on revenue generation from our legacy products in order to fund development of our new products; current market conditions, including the lack of liquidity in the markets and economic slowdown, may increase our operating costs or reduce our revenue, thereby negatively impacting our operating results; our ability to operate profitably and generate positive cash flows in the future; the impact of the current economic crisis on our suppliers and customers and our ability to transfer parts to other suppliers; our dependence on our foundry suppliers and third-party subcontractors; order cancellations and deferrals by our customers; our substantial indebtedness could adversely affect our financial position; the cost and accounting implications of compliance with new accounting standards; and other factors referenced in our Annual Report on Form 20-F. Investors are encouraged to consider the risks detailed in this filing.

Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.


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