Science & Technology
Science and Technology
Science and Technology
Wed, July 14, 2010
Tue, July 13, 2010
PORTLAND, Ore.--([ BUSINESS WIRE ])--Electro Scientific Industries (Nasdaq: ESIO), a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry, today unveiled its new 9900 system for ultra-thin wafer dicing. Announced at the SEMICON West 2010 tradeshow in San Francisco, ESIa™s fully automated 9900 system delivers unparalleled die break strength (DBS) with a proprietary, highly efficient, laser-based architecture for rapidly dicing ultra-thin silicon wafers (<50 microns).
"The 9900 is revolutionary for the semiconductor industry as it will enable our customers to fully adopt 3D integration into their high volume manufacturing environments"
aAs higher levels of functionality are being incorporated into portable electronic devices, the wafers required for advanced packaging and 3D integration applications are getting thinner and thinner,a said Nick Konidaris, president and CEO of ESI. aOur customers are pushing the current limits of traditional wafer dicing equipment and are demanding advanced technologies to improve yields and total cost of ownership.a
Breakthrough technology for advancing market needs
Miniaturization and convergence are driving a significant increase in 3D packaging technology. Semiconductor Equipment and Materials International (SEMI®) reports that 3D integration is anticipated to be pivotal for future growth of the semiconductor industry.1 Ultra-thin wafers are required to support the advancements in 3D packaging, such as:
- Stacked memory for high density storage applications
- System in package(SiP) that combines stacked logic and memory
- Through silicon via (TSV) interconnect applications
There are challenges with using mechanical technology for dicing ultra-thin wafers due to cracking, chipping, and other yield and quality issues. ESIa™s 9900 is the first production-ready, fully automated wafer dicing system that uses its proprietary laser-based architecture to quickly and efficiently cut ultra-thin wafers. The 9900 reliably yields die that can withstand the rigors of advanced packaging requirements.
aThe 9900 is revolutionary for the semiconductor industry as it will enable our customers to fully adopt 3D integration into their high volume manufacturing environments,a said Louis Vintro, vice president and general manager of ESIa™s Semiconductor Products Division. aBy combining ESI's proprietary processing technology with our world-class systems expertise, we are delivering the first production-worthy ultra-thin wafer dicing solution.a
Optimized for high precision and speed, the innovative features and benefits delivered by the 9900 include:
- Advanced technology in one integrated system a" The 9900 enables full-cut dicing of ultra-thin wafers and scribing logic or system on chip (SoC) wafers on die attach films (DAFs) in one integrated system.
- Unparalleled die break strengtha" Some wafers have delicate, brittle, low k materials on the topmost layers of the wafer. Cutting through this without damage is critical. The 9900 uses a proprietary laser and dry etch process to maximize die strength for the most challenging applications.
- Increased precision and yieldsa" The 9900 uses a precision-controlled laser with 355nm wavelength output to the ultra-thin wafer surface. This enables manufacturers to minimize scribe line widths and produce more die per wafer.
- Optimized run ratesa" The easy-to-use software and recipe library allow customers to optimize run rates for their specific manufacturing applications.
Pricing and availability
The 9900 is available for production deliveries in the second half of 2010 and priced to deliver the lowest cost of ownership for ultra-thin wafer dicing. More information on ESIa™s new 9900 system for ultra-thin wafer dicing is available at ESIa™s SEMICON West booth (#2221, South Hall, Moscone Center) or on ESIa™s website at [ www.esi.com/products/semiconductor.aspx ].
About ESI, Inc.
ESI is a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry. Our systems enable precise structuring and testing of micron to submicron features in semiconductors, electronic devices, LEDs and other high-value components. We partner with our customers to make breakthrough technologies possible in the semiconductor, microelectronics and other emerging industries. Founded in 1944, ESI is headquartered in Portland, Ore, with global operations from the Pacific Northwest to the Pacific Rim. More information is available at [ www.esi.com ].
Forward-Looking Statements
This press release includes forward-looking statements about the markets we serve, profitability and growth. These forward-looking statements are based on information available to us on the date of this release and we assume no obligation to update these forward-looking statements for any reason. Actual results may differ materially from those in the forward-looking statements. Risks and uncertainties that may affect the forward-looking statements include: the risk that anticipated growth opportunities may be smaller than anticipated or may not be realized; risks related to the relative strength and volatility of the electronics industry - which is dependent on many factors including component prices, global economic strength and political stability, and overall demand for electronic devices (such as capacitors, semiconductor memory devices and advanced electronic packages) used in wireless telecommunications equipment, computers and consumer and automotive electronics; the health of the financial markets and availability of credit for end customers and related effect on the global economy; the ability of the company to develop, manufacture and successfully deliver new products and enhancements; the companya™s need to continue investing in research and development; the companya™s ability to hire and retain key employees; and the companya™s ability to create and sustain intellectual property protection around its products.
1a3D Integration: A Progress Report,a Semiconductor Equipment and Materials International (SEMI®)
