Science & Technology
Science and Technology
Science and Technology 
Tue, February 17, 2009
Mon, February 16, 2009
InterDigital Showcases Integrated SlimChip HSPA Modem on the Texas Instruments Advanced OMAP 3 Development Platform
BARCELONA, Spain--([ BUSINESS WIRE ])--InterDigital, Inc. (NASDAQ:IDCC) showcased the operation of its integrated SlimChip HSPA Modem on a live 3G Network. InterDigital's module, which can be efficiently integrated with a variety of applications processors, is being demonstrated in the Texas Instruments advanced new OMAP 3 Mobile Development Platform (MDP) running the Android Mobile Platform. InterDigital's SlimChip MID Module is available as a pre-integrated 3G modem option for the Zoom OMAP34x-II MDP, delivering instant wireless connectivity for voice and data with mobile broadband performance to a growing category of innovative mobile broadband devices, such as Smartphones, notebooks, Mobile Internet Devices, or MIDs, and consumer electronics.
The compact SlimChip MID Module has been pre-integrated with TI's full-featured evaluation platform built around the popular OMAP34x processors to accelerate customer evaluations and product development. The SlimChip Embedded Modules are stand alone "wireless engines" that efficiently interface with a variety of application processors (APs), including the newly announced second generation OMAP 4 from TI. The SlimChip MID Module supports leading mobile operating systems such as the Android Mobile Platform, Linux, LiMo, Symbian OS and Microsoft Windows Mobile.
"We are pleased to be the wireless modem supplier for TI's advanced OMAP 3 platform. Our high performance HSPA modem offers instant mobile broadband connectivity, accelerating the development of compelling new applications," stated Mark Lemmo, Executive Vice President, Business Development for InterDigital. "Available as a 3G modem option, InterDigital's SlimChip MID Module has been pre-integrated with the Zoom OMAP34x-II MDP, allowing mobile application developers and OEMs to fully exploit the rich capabilities of this platform."
"TI is focused on advancing the mobile user experience, including support for advanced multimedia capabilities, as well as a variety of connectivity options, including 3.5G modem technology such as that offered by InterDigital," said Bill Crean, Strategic Marketing Manager, TI. "The flexible architecture of the OMAP 3 platform allows it to easily connect to InterDigital's SlimChip MID Module. The combination of these technologies provides OEMs with a powerful solution that will foster innovation and drive creative application development."
About InterDigital
InterDigital® designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip™ high performance mobile broadband modem solutions, consisting of Baseband ICs, Embedded Modules, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.
InterDigital is a registered trademark and SlimChip is a trademark of InterDigital, Inc. All other trademarks are property of their respective owners.
For more information, visit: [ www.interdigital.com ]