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Rambus to Present Design Challenges for Mobile Applications at 2011 Design, Automation & Test Conference


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GRENOBLE, France--([ BUSINESS WIRE ])--Rambus Inc. (NASDAQ: RMBS):

"Challenges in Designing High Speed Memory Subsystem for Mobile Applications"

Who:

Rambus Inc. (NASDAQ: RMBS)

Where:

DATE Conference

Alpexpo Espace Alpes Congres
Grenoble, France

When:

March 14-18, 2011

Join [ Rambus Inc. ], one of the world's premier technology licensing companies, at the 2011 Design, Automation & Test in Europe Conference. Rambus will present a paper on challenges in designing high-speed memory subsystems in mobile applications.

Rambus Presentation:

Wednesday, March 16, 9:15am GMT
"Challenges in Designing High Speed Memory Subsystem for Mobile Applicationsa
Presenter: Deborah Dressler, System Design Engineer, Rambus

There are a number of constraints imposed on the design of components for mobile devices, including form factor, safety issues, heat dissipation and in-system electromagnetic interference. Rambusa™ Deborah Dressler will discuss these design challenges as they relate to next-generation low-power DRAM subsystems. This paper will highlight key solutions, including a new mobile DRAM interface operating at multi-gigabits per second.

About Rambus Inc.

Founded in 1990, Rambus is one of the worlda™s premier technology licensing companies. As a company of inventors, Rambus focuses on the development of technologies that enrich the end-user experience of electronic systems. Its breakthrough innovations and solutions help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Headquartered in Sunnyvale, California, Rambus has regional offices in North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan. Additional information is available at [ www.rambus.com ].

RMBSTN


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