Science & Technology
Fri, March 16, 2012
CHANDLER, Ariz.--([ BUSINESS WIRE ])--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that Mike Liang has joined the company as President of Amkor Technology Taiwan. Liang and his team are responsible for servicing our packaging and test customers and executing our strategies in Taiwan.
"Mike Liang is a seasoned manufacturing executive with a proven track record in operations, sales and marketing for semiconductor packaging, wafer processing and testing services"
aMike Liang is a seasoned manufacturing executive with a proven track record in operations, sales and marketing for semiconductor packaging, wafer processing and testing services,a said JooHo Kim, Amkoras executive vice president, worldwide manufacturing operations. aMikeas extensive industry experience and proven leadership skills are a great fit for our manufacturing team.a
Liang joins Amkor Technology Taiwan from King Yuan Electronics Corporation in Hsin-Chu, Taiwan, where he most recently served as president and chief executive officer. Prior to King Yuan Electronics Corporation, Liang held various executive and operational roles at Phoenix Semiconductor International, AbelLink Technology, Mosel-Vitelix, Ti-Acer, and United Microelectronics Corporation. Liang holds a Bachelor of Science in physics from National Cheng Kung University and an MBA from National Taiwan University.
About Amkor
Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the companyas Securities and Exchange Commission (the aSECa) filings and on Amkoras website: [ www.amkor.com ].