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CHANDLER, Ariz.--([ BUSINESS WIRE ])--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that it has granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo: 6967) a non-exclusive license to its proprietary Through Mold Via (aTMVa) technology. The agreement provides for the transfer of Amkoras TMV technology to SHINKO and a license under Amkoras patents to enable SHINKO to manufacture packages based on this technology. The license also permits SHINKO to use Amkoras registered TMV trademark in its sales and marketing activities.

"Technology innovation has always been a key component of our success, and our proprietary TMV technology has been widely adopted in the rapidly growing smartphone and tablet markets"

aTechnology innovation has always been a key component of our success, and our proprietary TMV technology has been widely adopted in the rapidly growing smartphone and tablet markets,a said Ken Joyce, Amkoras president and chief executive officer. aWe are pleased to license our TMV technology to SHINKO, a respected outsourced assembly and test provider. This engagement will provide our customers the option of having multiple sources for TMV packaging services.a

aThis licensing agreement is significant for SHINKO,a said Fumio Kuraishi, SHINKOas President and Representative Director. aThe availability of Amkoras innovative TMV technology will provide SHINKO with a time-to-market advantage and enable us to provide our customers with state-of-the-art solutions for their 3D package stacking needs.a

Since their introduction, package-on-package (aPoPa) components have been rapidly adopted for 3D integration of logic and memory. Amkoras TMV technology enables leading-edge PoP designs for smartphone and tablet applications, delivering increased integration, miniaturization and performance without requiring the development of new surface mount stacking infrastructure or adding cost. Amkoras TMV technology improves warpage control, reduces package thickness, facilitates finer pitch memory interfaces, enables both wirebond and flip chip interconnects and supports stacked die or passive integration requirements.

About Amkor

Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the company's SEC filings and on Amkor's website: [ www.amkor.com ]

About SHINKO

SHINKO was founded in Nagano, Japan in 1946. SHINKO is an all around manufacturer of semiconductor packages, notably lead frame and PLP (Plastic Laminated Package), and recognized as a leader in the industry. More information on SHINKO is available on SHINKO's web site: [ http://www.shinko.co.jp/english/index.htm ]