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What:	Altera Corporation's (Nasdaq: [ ALTR ]) vice president of IC engineering, Bradley Howe, will deliver a keynote presentation at the upcoming 3D Architectures for Semiconductor Integration and Packaging Conference. In his keynote presentation, Mr. Howe will discuss how the convergence of system requirements is making way for 3D programmable ICs and highlight why FPGAs are primed for 3D integration.

	Mr. Howe's presentation will look at the macro trends that are driving the industry toward 3D semiconductor architectures and address how these trends are impacting semiconductor design and manufacturing. Mr. Howe will also share Altera's vision for heterogeneous programmable ICs and discuss challenges the industry faces.

Where:	3D Architectures for Semiconductor Integration and Packaging Conference
	Burlingame, Calif., December 12-14, 2011

When:	Mr. Howe's presentation session is scheduled for December 14 at 7:45 a.m.

For additional information visit [ http://techventure.rti.org/index.html ].

About the 3D Architectures for Semiconductor Integration and Packaging Conference

This conference provides a broad, yet thorough perspective on the technology/market opportunities and challenges offered by building devices and systems in the vertical dimension. Industry leaders from around the world will speak on a range of topics that are important to the emerging and ongoing 3D integration and packaging efforts. The format of the conference and its presentations enable speakers to present the most up-to-date and forthright perspective on the latest innovations in 3D integration. For more information about this conference and its list of speakers, visit [ http://techventure.rti.org/index.html ].

About Altera

Altera programmable solutions enable system and semiconductor companies to rapidly and cost-effectively innovate, differentiate and win in their markets. Find out more about Altera's [ FPGA ], [ CPLD ] and [ ASIC ] devices at [ www.altera.com ]. Follow Altera via [ Facebook ], [ RSS ] and [ Twitter ].

ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at [ www.altera.com/legal ].

Editor Contact:
Steve Gabriel
Altera Corporation
(408) 544-6846
[ newsroom@altera.com ]

SOURCE Altera Corporation

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Altera's Vice President of IC Engineering Details Emergence of 3D Programmable ICs

Altera's Vice President of IC Engineering Details Emergence of 3D Programmable ICs

Brad Howe to Deliver Keynote at the 3D Architectures for Semiconductor Integration and Packaging Conference on December 14