Science & Technology
Wed, February 23, 2011Tue, February 22, 2011Mon, February 21, 2011Sun, February 20, 2011Fri, February 18, 2011Thu, February 17, 2011Wed, February 16, 2011Tue, February 15, 2011Mon, February 14, 2011Temptronic and Sigma Systems to Operate Under the Name inTEST Thermal Solutions Corp.
Published in Science and Technology on Thursday, February 17th 2011 at 3:41 GMT by Market Wire
MOUNT LAUREL, NJ--(Marketwire - February 17, 2011) - inTEST Corporation (
James Pelrin, president of inTEST Thermal Solutions Corp., noted, "This is the next step in the process of broadening the marketing range and engineering capabilities of the two separate entities. Together, Temptronic and Sigma Systems have been engineering and marketing leading-edge thermal solutions for over 100 years, solving unique and challenging temperature problems. Under the banner of inTEST Thermal Solutions Corporation, the division will engineer the broadest range of temperature related test, conditioning, and process products on the market." Mr. Pelrin continued, "We specialize in meeting the most demanding applications by engineering unique thermal test solutions, whether it is a "non-standard" size, very specific and challenging transition rates, specialized access ports or temperature testing in a localized area. Our products include thermal chambers and platforms, air and fluid chillers, semiconductor test tools, and our unique mobile temperature test system, all backed by the most comprehensive thermal test expertise in the industry."
The Thermal division product line addresses a number of growth markets, including High-Speed Networking and the use of Fiber Optic components and devices for 4G and 10G communications, Broadband TV satellites, and Military applications. Mr. Pelrin commented, "Fiber Optic component devices are tested for temperature and contribute to the support of a variety of services, including broadcast television, video-on-demand and high-speed Internet access. Our thermal products add to the reliability of these fiber optic components, as our customers who manufacture these types of components and devices need extremely precise temperature which standard temperature equipment cannot deliver. This makes the thermal division's specialty products such as ThermoStream® unique to the challenges for temperature testing in the manufacturing process of these and other devices in this Hi-Speed 4G and 10G components arena. These types of applications, and the demands for more precise temperature controls in these technologies, are what differentiate our temperature management products over other temperature test equipment companies. The growth of fiber optic communication devices in the Mobile Internet and Hi-Speed Networking markets has been both rapid and technically sophisticated, necessitating increasing thermal testing requirements. inTEST Thermal Solutions is optimally positioned, with a broad product line that will continue to fuel the growth in these applications and technology market segments."
About inTEST Corporation
inTEST Corporation is an independent designer, manufacturer and marketer of ATE interface solutions and temperature management products, which are used by semiconductor manufacturers to perform final testing of integrated circuits (ICs) and wafers. The Company's high-performance products are designed to enable semiconductor manufacturers to improve the speed, reliability, efficiency and profitability of IC test processes. Specific products include positioner and docking hardware products, temperature management systems and customized interface solutions. The Company has established strong relationships with semiconductor manufacturers globally, which it supports through a network of local offices. For more information visit [ www.intest.com ].
Forward-Looking Statements:
This press release includes forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These statements do not convey historical information, but relate to predicted or potential future events that are based upon management's current expectations. These statements are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. In addition to the factors mentioned in this press release, such risks and uncertainties include, but are not limited to, changes in business conditions and the economy, generally; changes in the demand for semiconductors, generally; changes in the rates of, and timing of, capital expenditures by semiconductor manufacturers; progress of product development programs; increases in raw material and fabrication costs associated with our products; implementation of additional restructuring initiatives and other risk factors set forth from time to time in our SEC filings, including, but not limited to, our periodic reports on Form 10-K and Form 10-Q. The Company undertakes no obligation to update the information in this press release to reflect events or circumstances after the date hereof or to reflect the occurrence of anticipated or unanticipated events.
