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Hittite Microwave Corporation to Present at the Barclays Capital 2010 Global Technology Conference

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^{Published in Science and Technology on Monday, November 22nd 2010 at 15:45 GMT by Market Wire}  

CHELMSFORD, Mass.--([ BUSINESS WIRE ])--Hittite Microwave Corporation (NASDAQ:HITT) today announced that it will present at the Barclays Capital 2010 Global Technology Conference on Wednesday, December 8, 2010, at the Palace Hotel in San Francisco, CA. Hittitea™s presentation is currently scheduled for 4:30 p.m. PT. Representing the company at the conference will be Stephen G. Daly, Chairman, President and Chief Executive Officer and William W. Boecke, Vice President and Chief Financial Officer. A webcast of the companya™s presentation will be available on the investor relations page of the companya™s website at [ www.hittite.com ].

About Hittite Microwave Corporation

Hittite Microwave is an innovative designer and developer of high-performance integrated circuits, or ICs, modules, subsystems and instrumentation for technically demanding radio frequency, or RF, microwave and millimeterwave applications. Products include amplifiers, attenuators, broadband time delay, comparators, data converters, DC power conditioning, DC power management, dielectric resonator oscillators, filters-tunable, frequency dividers and detectors, frequency multipliers, high speed digital logic, interface, limiting amplifiers, mixers and converters, modulators and demodulators, multiplexers and demultiplexers, oscillators, passives, phase lock loop (PLL), PLL with integrated VCOs, phase shifters, power detectors, sensors, switches, synthesizers, transimpedance amplifiers and variable gain amplifiers. Hittite's products are used in a variety of applications and end markets including automotive, broadband, cellular infrastructure, fiber optic, microwave and millimeterwave communications, military, space, and test and measurement. The company utilizes radio frequency integrated circuits (RFIC), monolithic microwave integrated circuits (MMIC), multi-chip modules (MCM) and microwave integrated circuit (MIC) technologies. The company is headquartered in Chelmsford, MA.