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Published in Science and Technology on Tuesday, May 7th 2013 at 6:16 GMT by Market Wire
May 07, 2013 09:00 ET
Vicor's Breakthrough ChiP Power Component Packaging Technology to Make European Debut at PCIM Europe 2013
Vicor Product Demonstrations and Technical Presentations on Tap for Premier Power Electronics Conference; Attendees Can Visit Vicor at Hall 9 Stand 155
ANDOVER, MA--(Marketwired - May 7, 2013) - Vicor Corporation (
PCIM 2013 will mark the highly anticipated European unveiling of Vicor's new [ Converter housed in Package (ChiP) ] power component packaging technology, recently introduced in the United States at APEC 2013. ChiP packaging technology leverages Vicor's world-class power expertise and manufacturing capabilities to enable a new generation of ultra high density, thermally optimized power components. Components based on Vicor's scalable ChiP packaging technology will provide a staggering 4X increase in power density and 20% reduction in power loss versus earlier generation components, equipping customers to achieve previously unattainable system size, weight and power efficiency targets.
At Vicor's booth, attendees can visit with Vicor's team of power management architects to learn more about solutions and trends such as [ 400 VDC bus conversion solutions ] for power distribution, VR12-conformant, direct 48V-to-processor power conversion solutions, [ customer-configurable VI Chip® PRM® modules ], and [ Zero-Voltage Switching (ZVS) point-of-load DC-DC regulation ]. Vicor will also present two technical papers at the conference, titled "Controlled-Bus Architecture with Voltage Equalization: A System Approach to Higher Efficiency in Low Voltage DC Distribution" and "Control of a Discontinuous-Conduction-Mode ZVS Buck-Boost Topology for Microprocessor Core Power."
PCIM 2013 is a leading international conference focused on power electronics and its applications in intelligent motion, renewable energy and energy management. PCIM 2013 offers a wide range of seminars and networking opportunities, which together comprise an ideal platform for dialogue and exchange of ideas centric to research, applications and product development.
Conference attendees can visit Vicor at Hall 9 Stand 155 in the Nuremberg Exhibition Centre.
About Vicor Corporation
Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high-performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the wall plug to the point-of-load. Complementing an extensive portfolio of patented innovations in power conversion and power distribution with significant application development expertise, Vicor offers comprehensive product lines addressing a broad range of power conversion and management requirements across all power distribution architectures, including CPA, DPA, IBA, FPA™ and CBA. Vicor focuses on solutions for performance-critical applications in the following markets: enterprise and high performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics. [ www.vicorpower.com ]
Vicor, VI Chip, PRM and FPA are trademarks of Vicor Corporation.
