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Rambus to Demonstrate Mobile XDRa" and DDR3 Memory Solutions at Denali's MemCon 2010


//science-technology.news-articles.net/content/2 .. r3-memory-solutions-at-denali-s-memcon-2010.html
Published in Science and Technology on Wednesday, July 28th 2010 at 6:11 GMT by Market Wire   Print publication without navigation


SANTA CLARA, Calif.--([ BUSINESS WIRE ])--Rambus Inc. (NASDAQ:RMBS):

"Challenges and Solutions for GHz DDR3 Memory Interface Design"

Who:

Rambus Inc. (NASDAQ:RMBS)

Where:

Denali MemCon 2010
Hyatt Regency Santa Clara
Convention Center Ballrooms A-H
Santa Clara, California

When:

July 28, 2010

Join Rambus Inc., one of the worlda™s premier technology licensing companies, at MemCon 2010, for presentations and demonstrations of its innovations including:

Rambus Demos:

  • Mobile XDRa" Architecture: The fastest and most power-efficient memory for mobile applications. Capable of achieving data rates of 3.2 to 4.3 gigabits per second (Gbps) at an unprecedented power efficiency of 2.2 milliwatts per gigabit per second (mW/Gbps), Mobile XDR memory is ideal for next-generation smartphones, netbooks, and mobile gaming and multimedia products.
  • DDR3 PHY for consumer electronics: The worlda™s first high-performance DDR3 interface solution implemented in a low-cost wire bond package performing memory transactions to and from a DDR3 SDRAM device operating at 1866 megatransfers per second (MT/s) with architectural support for data rates of up to 2133MT/s.

Rambus Presentations:

Wednesday, July 28, 3:30 p.m. PT

aChallenges and Solutions for GHz DDR3 Memory Interface Designa

Presented by Arun Vaidyanath, Senior Engineer at Rambus

During this session, Arun Vaidyanath will discuss the technical challenges engineers face when designing and integrating DDR3 memory controller interfaces operating beyond 1GHz in high-volume, low-cost packages for consumer electronics. The session will address methods for maintaining signal integrity at high speed even in wire bond implementations.

Wednesday, July 28, 5:15 p.m. PT

Panel: aMemory Interfaces: What Comes after DDR3?a

Judy Chen, Ph.D., Strategic Development Director at Rambus

Dr. Judy Chen will share the stage with other industry experts to examine whata™s in store for memory after DDR3. During this session, panelists will discuss the future of memory and how consumer needs will play a pivotal role in next-generation application requirements.

About Rambus Inc.

Rambus is one of the worlda™s premier technology licensing companies. Founded in 1990, the Company specializes in the invention and design of architectures focused on enhancing the end-user experience of electronic systems. Rambusa™ patented innovations and breakthrough technologies help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, Ohio, India, Germany, Japan, and Taiwan. Additional information is available at [ www.rambus.com ].

Rambus and the Rambus logo are registered trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.

RMBSTN


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