Wed, December 11, 2024
Tue, December 10, 2024

US Finalises More Than $6.1 Billion Chips Subsidy for Micron Technology

The U.S. Department of Commerce has finalized a deal to provide Micron Technology with over $6.1 billion in subsidies to support the construction of new semiconductor manufacturing facilities in New York and Idaho. This initiative is part of the broader CHIPS and Science Act, aimed at boosting domestic semiconductor production. The funding will help Micron build a significant manufacturing hub in Clay, New York, and expand its operations in Boise, Idaho, with the goal of creating thousands of jobs and enhancing U.S. competitiveness in the global semiconductor market. The project is expected to start construction in 2025, with production potentially beginning by the end of the decade.

Read the Full MSN Article at:
[ https://www.msn.com/en-in/news/techandscience/us-finalises-more-than-6-1-billion-chips-subsidy-for-micron-technology/ar-AA1vE3sW ]