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SINGAPORE--([ BUSINESS WIRE ])--Kulicke & Soffa (NASDAQ: KLIC), a global leader in the design and manufacture of semiconductor assembly equipment, today announces the appointment of Ms. Pui Yee Lee as Vice President & Corporate Treasurer. She will report directly to Senior Vice President & Chief Financial Officer, Jonathan Chou.

"We welcome Pui Yee to K&S. Her impressive financial background and direct experience working for a leading Asian-based technology company make her well suited to join our team. We look forward to her contributions and perspective."

Pui Yee has 20 years of international financial experience and is a CFA charterholder. She received her Bachelor of Social Sciences (Hons) with a major in Economics, from the National University of Singapore and received an MBA from INSEAD. She joins K&S from Flextronics Manufacturing (HK) Ltd., where she provided leadership oversight for its treasury organization in Asia.

Jonathan Chou, Chief Financial Officer, commented, aWe welcome Pui Yee to K&S. Her impressive financial background and direct experience working for a leading Asian-based technology company make her well suited to join our team. We look forward to her contributions and perspective.a

Prior to Flextronics, Pui Yee spent 9 years at Honeywell, where she served in various treasury positions in Brussels, Shanghai and Singapore focusing on cash and liquidity initiatives, foreign exchange exposure mitigation and investment management. Notably, Pui Yee played an instrumental role in formulating and implementing a strategic roadmap for Honeywellas treasury organization in Asia. She previously served as a portfolio manager for the Government of Singapore Investment Corporation (GIC) and provided corporate clients with treasury advisory services at the Development Bank of Singapore.

In addition to English, Pui Yee is fluent in Mandarin and Cantonese.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding die and wedge bonders and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. ([ www.kns.com ]).