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ESI to Present at Two Upcoming Investor Conferences

^{Published on 2010-11-01 07:42:16 - Market Wire}
 

PORTLAND, Ore.--([ BUSINESS WIRE ])--Electro Scientific Industries, Inc. (NASDAQ: ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, is scheduled to present at two upcoming investor conferences a" TechAmericaa™s 40^th Annual AeA Classic Financial Conference on November 8 and at Sidoti & Companya™s New York II Emerging Growth Institutional Investor Forum on November 16.

The event details are as follows:

About ESI, Inc.

ESI is a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry. Our systems enable precise structuring and testing of micron to submicron features in semiconductors, electronic devices, LEDs and other high-value components. We partner with our customers to make breakthrough technologies possible in the semiconductor, microelectronics and other emerging industries. Founded in 1944, ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at [ www.esi.com ].

Forward-Looking Statements

This press release includes forward-looking statements about the markets we serve, profitability and growth. These forward-looking statements are based on information available to us on the date of this release and we assume no obligation to update these forward-looking statements for any reason. Actual results may differ materially from those in the forward-looking statements. Risks and uncertainties that may affect the forward-looking statements include: the risk that anticipated growth opportunities may be smaller than anticipated or may not be realized; risks related to the relative strength and volatility of the electronics industry - which is dependent on many factors including component prices, global economic strength and political stability, and overall demand for electronic devices (such as capacitors, semiconductor memory devices and advanced electronic packages) used in wireless telecommunications equipment, computers and consumer and automotive electronics; the health of the financial markets and availability of credit for end customers and related effect on the global economy; the ability of the company to develop, manufacture and successfully deliver new products and enhancements; the companya™s need to continue investing in research and development; the companya™s ability to hire and retain key employees; and the companya™s ability to create and sustain intellectual property protection around its products.