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Verigy Adds Direct-Probea" Solution to its V93000 Platform for the Wafer-Level CSP Market

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  Published in Science and Technology on Tuesday, June 29th 2010 at 13:11 GMT by Market Wire
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CUPERTINO, Calif.--([ BUSINESS WIRE ])--Verigy (NASDAQ:VRGY), a leading semiconductor test company, has extended the scalability of its production-proven V93000 platform by adding the Direct-Probe^a" solution. This high-performance probe test capability for digital, mixed-signal and wireless communication ICs delivers one of the highest signal integrity levels available for production-volume, multi-site probe testing.

"As wafer-level chip scale packaging gains momentum, testing currently done with handlers on singulated packaged devices is moving to multi-site, non-singulated testing on wafer probers"

The innovative new Direct-ProbeRF solution reduces the cost of test for radio-frequency (RF), high-pin-count digital and complex mixed-signal devices, addressing the global semiconductor marketa™s rapid shift to performance probe test and wafer-level chip scale packages (WLCSP). By removing the conventional mechanical interface between the wafer and tester, Verigya™s V93000 platform equipped with the Direct-Probe RF solution reduces the length and number of signal-path connections, significantly improving signal integrity for RF device testing.

The V93000 with Direct-Probe RF solution can be designed to use a single-load board for both wafer probe and final test. This reduces the time between IC development and production, minimizes the correlation effort between probe and final test, and enables high multi-site capability. Verigya™s Direct-Probe RF capability also provides the largest component area for application use while maintaining planarity of 1 mm over a 44,000-square-millimeter area.

In addition, V93000 Direct-Probe solutions offer full platform compatibility with all tester configurations while the V93000a™s scalable architecture provides the versatility to test the full spectrum of RF-based semiconductor devices.

aAs wafer-level chip scale packaging gains momentum, testing currently done with handlers on singulated packaged devices is moving to multi-site, non-singulated testing on wafer probers,a said Hans-Juergen Wagner, Verigya™s vice president of SOC test solutions. aEssentially, this means that device packaging is becoming the last step in wafer processing, driving final testing onto the probe line. Addressing this trend, we believe our new Direct-Probe RF solution delivers the industrya™s highest performance for wafer probing and provides the lowest cost of test while maximizing test resources for a broad range of ICs including wireless devices used in Bluetooth products, global positioning systems and wireless LANs (local area networks).a

About Verigy

Verigy provides advanced semiconductor test systems and solutions used by leading companies worldwide in design validation, characterization, and high-volume manufacturing test. Verigy offers scalable platforms for a wide range of system-on-chip (SOC) test solutions, and memory test solutions for Flash, DRAM including high-speed memories, as well as multi-chip packages (MCP). Verigy also provides advanced analysis tools that accelerate design debug and yield ramp processes. Additional information about Verigy can be found at [ www.verigy.com ].