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Ultratech Receives 2012 Supplier Excellence Award From Texas Instruments

^{Published on 2013-04-18 05:45:58 - Market Wire}
 

Ultratech Receives 2012 Supplier Excellence Award From Texas Instruments -- SAN JOSE, Calif., April 18, 2013 /PRNewswire/ --

SAN JOSE, Calif., April 18, 2013 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: [ UTEK ]), a leading supplier of lithography and laser-processing systems, today announced that it is a recipient of  the 2012 Supplier Excellence Award from Texas Instruments Incorporated (TI). The award recognizes Ultratech as a supplier who contributed significantly to TI's business success through outstanding performance and continuous improvement in providing advanced packaging lithography systems to TI. The 12 award recipients are an elite group of suppliers among a base of more than 12,000 companies chosen for their exemplary performance in the areas of cost, environmental and social responsibility, technology, responsiveness, assurance of supply, and quality. 

Ultratech Chairman and Chief Executive Officer Arthur W. Zafiropoulo stated, "We are honored to receive this award from TI as it is a reflection of Ultratech's on-going commitment to providing the highest quality products with strong after-sales support.  In addition to investing heavily in R&D, we have also expanded our service infrastructure in key regions around the world. Delivering technology products with a clear focus on great customer service has culminated in this award from TI. The recognition from TI also validates our efforts to provide the most advanced technology in a cost-effective solution to enable the business success of our customers."

"We look to Ultratech, as a key business partner, to help us achieve our priorities through outstanding execution, quality and performance," said Rob Simpson , TI's vice president of worldwide procurement and logistics. "Ultratech is an integral component of our mission to provide the products that help our customers transform the future, today."

Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "thinks," "intends," "will," "could," "may," "believes," "poised," "estimates," "continues," "looks forward to," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to timing, delays, deferrals and cancellations of orders by customers, including as a result of semiconductor manufacturing capacity as well as our customers' financial condition and demand for semiconductors; demand for consumer devices; industry growth within the company's served markets; continued delivery of financial performance and value; cyclicality in the semiconductor and nanotechnology industries; our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; quarterly revenue fluctuations;  lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; general economic and financial market conditions including impact on capital spending, as well as difficulty in predicting changes in such conditions; rapid technological change and the importance of timely product introductions; customer concentration; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; changes in pricing by us, our competitors or suppliers; international sales and operations; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; effect of capital market fluctuations on our investment portfolio; ability and resulting costs to attract or retain key personnel; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon our achieving and maintaining profitability and the market price of our stock; mix of products sold; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; changes to financial accounting standards; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; foreign government regulations and restrictions; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in the Middle East, Afghanistan and elsewhere, or geopolitical instability on the Korean Peninsula and other parts of Asia, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2012. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.

About Ultratech: Ultratech, Inc. (Nasdaq: [ UTEK ]) designs, manufactures and markets photolithography and laser processing equipment.  Founded in 1979, the company's market-leading advanced lithography products deliver high throughput and production yields at a low, overall cost of ownership for bump packaging of integrated circuits and high-brightness LEDs (HB-LEDs).  A pioneer of laser processing, Ultratech developed laser spike anneal technology, which increases device yield, improves transistor performance and enables the progression of Moore's Law for 32-nm and below production of state-of-the-art consumer electronics. Visit Ultratech online at: [ www.ultratech.com ].

(UTEK-G)

SOURCE Ultratech, Inc.